Author:
Xiao Zhengxiang,Xue Songbai,Hu Yuhua,Ye Huan,Gao Lili,Wang Hui
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. M. McCormack, S. Jin, G.W. Kammlott. The design of new, Pb-free solder alloys with improved properties. IEEE Int. Symp. Electron. Environ. USA 171–176 (1995)
2. X. Chen, A.M. Hu, M. Li, D.L. Mao, Study on the properties of Sn-9Zn-xCr lead-free solder. J. Alloys Compd. 460, 478–484 (2008)
3. D.Q. Yu, H.P. Xie, L. Wang, Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate. J. Alloys Compd. 385(1–2), 119–125 (2004)
4. Y.S. Kim, K.S. Kim, Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys. J. Alloys compd. 352(2), 237–245 (2003)
5. W.X. Chen, S.B. Xue, H. Wang, Y.H. Hu, J.X. Wang. Effects of rare earth Ce on properties of Sn-9Zn lead-free solder. J. Mater. sci. Mate. Electron. doi: 10.1007/s10854-009-9984-2
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