Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Reliability testing of flexible printed circuit-based RF MEMS capacitive switches;Lee;Microelectron. Reliab.,2004
2. Applications of shadow Moiré method in determinations of thermal deformations in electronic packaging;Guo,1995
3. Thermomechanical behavior of micron scale solder joints under dynamic loads;Zhao;Mech. Mater.,2000
4. Out-of-plane displacement measurement of printed circuit board by shadow moiré with variable sensitivity;Han,1993
5. Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis;Tee;Microelectron. Reliab.,2004
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献