Numerical study of the effect of epoxy molding compound gradation on the thermo-mechanical properties of package-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Numerical study of the effect of epoxy molding compound gradation on the thermo-mechanical properties of package

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Lu Xiaoxin¹,Zhou Yu²,Ding Dongdong³,Rong Sun¹,Lu Jibao³

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology,Shenzhen,P.R. China

2. University of Science and Technology of China,Nano Science and Technology Institute,Hefei,P.R. China,230000

3. Chinese Academy of Sciences,Shenzhen Institutes of Advanced Technology,Shenzhen,P.R. China

Funder

National Natural Science Foundation of China

Youth Innovation Promotion Association

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492171.pdf?arnumber=10492171

Reference9 articles.

1. A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method

2. Polymeric Materials for Electronics Packaging and Interconnection

3. Effects of material properties on warpage in fused deposition modeling parts

4. Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process

5. Study of Package Reliability according to the Epoxy Molding Compound

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP