Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis-Reference-Cited by-同舟云学术

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Published:2004-01 Issue:1 Volume:44 Page:105-114
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Tee Tong Yan,Zhong Zhaowei

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Tee TY, Ng HS, Diot J, Frezza G, Tiziani R, Santospirito G. Comprehensive design analysis of QFN and PowerQFN packages for enhanced board level solder joint reliability. In: Proceedings of the 52nd Electronic Components and Technology Conference, ECTC, San Diego, CA, 2002. p. 985–91

2. Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages;Tee;Microelectron. Reliab.,2003

3. Fukuzawa I, Ishiguro S, Nanbu S. Moisture resistance degradation of plastic LSI’s by reflow soldering. In: Proceedings of IRPS, 1985. p. 192–7

4. Moisture absorption and desorption predictions for plastic ball grid array packages;Galloway;IEEE. Trans. CPMT––Part A,1997

5. Kitano M, Nishimura A, Kawai S. Analysis of package cracking during reflow soldering process. In: Proceedings of IRPS, 1988. p. 90–5

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