Author:
Tee Tong Yan,Zhong Zhaowei
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Tee TY, Ng HS, Diot J, Frezza G, Tiziani R, Santospirito G. Comprehensive design analysis of QFN and PowerQFN packages for enhanced board level solder joint reliability. In: Proceedings of the 52nd Electronic Components and Technology Conference, ECTC, San Diego, CA, 2002. p. 985–91
2. Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages;Tee;Microelectron. Reliab.,2003
3. Fukuzawa I, Ishiguro S, Nanbu S. Moisture resistance degradation of plastic LSI’s by reflow soldering. In: Proceedings of IRPS, 1985. p. 192–7
4. Moisture absorption and desorption predictions for plastic ball grid array packages;Galloway;IEEE. Trans. CPMT––Part A,1997
5. Kitano M, Nishimura A, Kawai S. Analysis of package cracking during reflow soldering process. In: Proceedings of IRPS, 1988. p. 90–5
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