On thermally-induced mechanical stress in high resistivity polysilicon resistors
Author:
Affiliation:
1. IIT Delhi,Department of Electrical Engineering,New Delhi,India,110016
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10181241/10181318/10181956.pdf?arnumber=10181956
Reference12 articles.
1. Modelling and measurements of thermomechanical stress induced drift on polysilicon resistors with different layout
2. thermo-mechanical stress analysis;niehoff;2009 European Microelectronics and Packaging Conference EMPC,2009
3. Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis
4. An 11.6af/kpa mechanical stress sensor with 0.808 % temperature-drift oscillator for flip-chip packaging;xiao;IEEE Transactions on Circuits and Systems II Express Briefs,2022
5. Stress-induced parametric shift in plastic packaged devices
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