Stress-induced parametric shift in plastic packaged devices
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/96/13906/00641515.pdf?arnumber=641515
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3. Characterization of Packaging‐Induced Stress Distributions for Small‐Scale Silicon Chips;IEEJ Transactions on Electrical and Electronic Engineering;2020-06-29
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