Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

Abstract

Abstract Delamination failure is one of the most prevalent and serious reliability issues in micro-electronic packaging. To understand this phenomenon further, this study constructs an experimental test system consisting of a double cantilever beam (DCB) fixture, an MTS-Acumen microforce tester, and a temperature and humidity controller. The system is employed to investigate the effects of coupled moisture-thermal loading on the critical strain energy release rate (SERR) at the epoxy molding compound (EMC)/Cu leadframe (LF) interface of a very thin quad flat no-lead package (WQFN) assembly. A three-dimensional computational model with hygro-thermal loading conditions is developed to evaluate the moisture diffusion, thermal stress, and integrated stress of a multichip WQFN package under typical processing conditions and precondition tests. The validated simulation model is then applied with the virtual crack closure technique (VCCT) to investigate the fracture behavior at the EMC/Cu LF interface in the WQFN package. The effects of three design parameters on the SERR performance of the package are identified through a parametric analysis. Finally, a Genetic Algorithm (GA) optimization method is employed to examine the effects of the main structural design parameters of the WQFN package on its delamination reliability. The results are used to determine the optimal packaging design that minimizes the SERR and hence enhances the package reliability.