Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging-Reference-Cited by-同舟云学术

Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging

Published:2022-03 Issue: Volume:130 Page:114488
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Shih Meng-Kai,Shih Sean,Liao Tse-Wei,Chen Dao-Long,Liu D.S.,Tarng David

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. Challenges of flip chip packaging with embedded fine line and multi-layer coreless substrate;Tang,2015

5. 2/2μm embedded fine line technology for organic interposer applications;Hu,2016

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