Liquid metal/metal porous skeleton with high thermal conductivity and stable thermal reliability-Reference-Cited by-同舟云学术

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Liquid metal/metal porous skeleton with high thermal conductivity and stable thermal reliability

Published:2023-12 Issue:47 Volume:58 Page:17829-17842
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Tan Liming,Zhang Jianbo,Shen Jun^ORCID

Funder

Jiangsu Provincial Key Laboratory of Advanced Micro and Nano Materials and Technology

Fundamental Research Funds for the Central Universities

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s10853-023-09159-y.pdf

Reference44 articles.

1. Ni S-H, Hu Y-F, Huang Y-C et al (2022) A dual cooling composite film by subtly combining phase change materials and thermally conductive fillers for efficient thermal management. J Mater Sci 57:14464–14477. https://doi.org/10.1007/s10853-022-07551-8

2. Sun Z, Li J, Yu M, Kathaperumal M, Wong C-P (2022) A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications. Chem Eng J 446:137319. https://doi.org/10.1016/j.cej.2022.137319

3. Shih M-K, Shih S, Liao T-W, Chen D-L, Liu DS, Tarng D (2022) Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging. Microelectron Rellab 130:114488. https://doi.org/10.1016/j.microrel.2022.114488

4. Zou L, Lin P, Zhang J, Su H, Chen Y (2022) Highly-efficient thermal management of electronic devices enabled by boron nitride-incorporated phase change material gels. J Mater Sci 57:20268–20284. https://doi.org/10.1007/s10853-022-07872-8

5. Sohel Murshed SM, Nieto de Castro CA (2017) A critical review of traditional and emerging techniques and fluids for electronics cooling. Renew Sustain Energy Rev 78:821–833. https://doi.org/10.1016/j.rser.2017.04.112

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