Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages
Author:
Funder
Ministry of Science and Technology, Taiwan
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
https://link.springer.com/content/pdf/10.1007/s40799-023-00679-5.pdf
Reference25 articles.
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2. John H, Lau (2019) Recent advances and Trends in Fan-Out Wafer/Panel-Level Packaging. J Electron Packag 141(4):1–27
3. Tu K-N, Chen C, Hung-Ming Chen (2021) Electronic packaging Science and Technology. Wiley, New Jersey
4. Shih M-K, Shih S, Liao T-W, Chen D-L, Liu DS, Tarng D (2022) Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging. Microelectron Reliab 130:114488
5. Shih M-K, Lai W-H, Liao T-W, Chen K, Chen D-L, Hung CP (2022) Thermal and mechanical characterization of 2.5-D and fan-out chip on substrate chip-first and chip-last packages. IEEE Trans Compon Packag Manuf Technol 12(2):197–305
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