Author:
Zhao Y,Basaran C,Cartwright A,Dishongh T
Subject
Mechanics of Materials,General Materials Science,Instrumentation
Reference15 articles.
1. Mechanics of Pb40/Sn60 near eutectic solder alloys subjected to vibrations;Basaran;Applied Mathematical Modeling,1998
2. Nonlinear dynamic analysis of surface mount interconnects: Part I. Theory;Basaran;ASME Journal of Electronic Packaging,1999
3. Nonlinear dynamic analysis of surface mount interconnects: Part II. Applications;Basaran;ASME Journal of Electronic Packaging,1999
4. Basaran, C., Zhao, Y., 1999. Closed form vs. finite element analysis of laminated stacks. International Journal of Finite Elements in Analysis and Design, accepted for publication
5. Chandaroy, R., 1998. Damage mechanics of microelectronic packaging under combined dynamic and thermal loading. Ph.D. dissertation, SUNY at Buffalo
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