Modeling ultrasonic vibration fatigue with unified mechanics theory

Author:

Lee Hsiao Wei,Basaran Cemal,Egner Halina,Lipski Adam,Piotrowski Michał,Mroziński Stanisław,Bin Jamal M Noushad,Lakshmana Rao Chebolu

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation

Reference86 articles.

1. Abbaschian, R., Abbaschian, L., & Reed-Hill, R., 2010, Physical metallurgy principles. Cengage Learning. ISBN 9780495438519.

2. Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging;Basaran;Comput. Struct.,2000

3. A thermodynamic model for electrical current induced damage;Basaran;Int. J. Solids Struct.,2003

4. Damage mechanics of electromigration in microelectronics copper interconnects;Basaran;Int. J. Mater. Struct. Integrity,2007

5. Electromigration induced strain field simulations for nanoelectronics lead-free solder joints;Basaran;Int. J. Solids Struct.,2007

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