Author:
Basaran Cemal,Lin Minghui,Ye Hua
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Reference34 articles.
1. Basaran, C., Nie, S. An irreversible thermodynamic theory for damage mechanics of solids. Int. J. Damage Mech., in press
2. Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronic packaging;Basaran;Int. J. Damage Mech.,2002
3. A damage mechanics based fatigue life prediction model for solder joints;Basaran;Trans. ASME, J. Electron. Packaging,2003
4. Basaran, C., Tang, H. Experimental damage mechanics of microelectronics solder joints. J. Damage Mech., in press
5. A thermodynamic frame work for damage mechanics of solder joints;Basaran;Trans. ASME, J. Electron. Packaging,1998
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