Author:
Basaran Cemal,Lin Minghui
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation
Reference24 articles.
1. The nucleation of cavities by plastic deformation;Goods;Acta Materialia,1978
2. Gleixner, R.J., Nix, W.D., An analysis of void nucleation in passivated interconnect lines due to vacancy condensation and interface contamination, Materials Reliability in Microelectronics VI, San Francisco, CA, April 8–12 1996, pp. 475–480.
3. Diffusional back flows during electromigration;Blech;Acta Materialia,1998
4. Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects;Park;Journal of Applied Physics,1999
5. Numerical simulation of stress evolution during electromigration in IC interconnect lines;Ye;IEEE Transactions on Components and Packaging Technologies,2003
Cited by
25 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献