Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications
Author:
Basaran C.1, Chandaroy R.2
Affiliation:
1. Electronic Packaging Laboratory, State University of New York at Buffalo, Buffalo, NY 14260 2. HKS ABAQUS Inc., Detroit, MI
Abstract
Using the unified constitutive model and the finite element procedure presented in Part I (the preceding paper), a material nonlinear time domain dynamic analysis of a solder joint was studied for low cycle and high cycle fatigue. Thermal effects were not included in order to understand the dynamic behavior of a Pb40/Sn60 solder joint without noise-effects from thermal behavior. The latter decision was a result of observations reported in Steinberg (1988), that having in-phase or out-of-phase thermal loading in conjunction with vibrations makes a significant difference in the fatigue life. The study of fatigue under concurrent loading will be the subject of another paper.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Barker D. , VodzakJ., DasguptaA., and PechtM., 1990, “Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain versus Life Approach,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 112, pp. 129–134. 2. Basaran, C., and Desai, C. S., 1995, “Finite Element Thermomechanical Analysis of Electronic Packaging Problems Using Disturbed State Constitutive Models,” report to the National Science Foundation, The University of Arizona, Tucson, AZ. 3. Basaran C. , and ChandaroyR., 1998, “Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory,” ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 121, No. 1, pp. 8–11. 4. Basaran, C., 1998, “Unified Disturbed State Concept,” Modeling to Applications in Geomechanics, John Wiley & Sons, New York. 5. Miner M. A. , 1945, “Cumulative Damage in Fatigue,” ASME Journal of Applied Mechanics, Vol. 12, pp. 21–29.
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