Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference48 articles.
1. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications
2. Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation
3. Modelling of Ag3Sn coarsening and its effect on creep of Sn–Ag eutectics
4. Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales
5. Impression creep characterization of rapidly cooled Sn–3.5Ag solders
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2. Investigating the influence of rotating magnetic field (RMF) on intermetallic compound crystallization, thermal and mechanical properties in lead-free Sn-Ag-Cu solder alloys during solidification;Materials Today Communications;2024-06
3. Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-06
4. Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging;Journal of Iron and Steel Research International;2023-08
5. Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures;Crystals;2023-03-29
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