Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures
Author:
Guo Xiaotong12ORCID, Zuo Xinlang2, He Hao1ORCID, Xiao Hui2, Liu Jiahao2, Tian Ruyu3, Liu Yufeng2
Affiliation:
1. Chongqing CEPREI Industrial Technology Research Institute Co., Ltd., Chongqing 401332, China 2. China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511370, China 3. School of Mechanical Engineering, Yangzhou University, Yangzhou 225127, China
Abstract
In deep space exploration the exploration equipment will inevitably experience the harsh environment of cryogenic temperature. Solder joints belong to the most vulnerable parts of electronic equipment, and the harsh environment of extreme cryogenic temperature will seriously threaten the reliability of solder joints. In this paper, Sn3.0Ag0.5Cu/Cu solder joints were prepared and stored at cryogenic temperatures (−50 °C, −100 °C, and −196 °C) for up to 960 h, whilst studying the microstructural evolution and deterioration of shear properties. The results showed that the influence of cryogenic temperature on microstructure deterioration was greater than that of storage time. With the decrease of storage temperature and the extension of storage time, the Ag3Sn intermetallic compounds (IMCs) were uniformly dispersed in the β-Sn matrix; the size decreased and the number increased. After being stored at −196 °C for 960 h, some microcracks appeared at the interface of the solder joints. Meanwhile, the shear force of the solder joints was reduced by 19.02%, and the fracture mode changed from ductile fracture to ductile–brittle mixed fracture. Therefore, it is of great scientific significance to reveal the microstructural evolution and deterioration of shear properties of the solder joints under long-term storage at cryogenic temperatures.
Funder
National Key R&D Program of China National Natural Science Foundation of China Natural Science Foundation of Jiangsu Province Science and Technology Program of Guangzhou of China CEPREI Innovation and Development Foundation
Subject
Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering
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