Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference37 articles.
1. Kinetics of interfacial reaction in bimetallic CuSn thin films
2. Reaction-Diffusion in the Cu–Sn System
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4. Analysis of Phase Transformation Kinetics by Intrinsic Stress Evolutions During the Isothermal Aging of Amorphous Ni(P) and Sn/Ni(P) Films
5. Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad
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2. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26
3. Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID);2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints;Materials;2022-12-16
5. Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer;Journal of Alloys and Compounds;2022-12
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