Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu–Sn intermetallic compounds in soldering reaction
Author:
Funder
National Science Council, Taiwan
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference25 articles.
1. Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
2. Wettability and interfacial reactions of Sn-based Pb-free solders with Cu–xZn alloy under bump metallurgies
3. Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder
4. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
5. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
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1. In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish;Electronic Materials Letters;2023-01-07
2. Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate;Journal of Materials Science: Materials in Electronics;2023-01
3. Reliability of laser soldering using low melting temperature eutectic Sn Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad;Materials Characterization;2022-12
4. Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish;Materials;2021-12-19
5. Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging;Journal of Materials Science: Materials in Electronics;2021-09-06
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