In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish
Author:
Funder
Ministry of Trade, Industry and Energy
Korea Institute of Advancement Technology
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s13391-022-00405-0.pdf
Reference40 articles.
1. Zhang, P., Xue, S., Wang, J.: New challenges of miniaturization of electronic devices: electromigration and thermomigration in lead-free solder joints. Mater. Des 192, 108726 (2020). https://doi.org/10.1016/j.matdes.2020.108726
2. Liang, C.L., Lin, Y.S., Kao, C.L., Tarng, D., Wang, S.B., Hung, Y.C., Lin, G.T., Lin, K.L.: Electromigration reliability of advanced high-density fan-out packaging with fine-pitch 2-/2-μm L/S Cu redistribution lines. IEEE Trans. Compon. Packag Manuf Technol. 10, 1438–1445 (2020). https://doi.org/10.1109/TCPMT.2020.2997824
3. Kim, G., Son, K., Lee, J.H., Joo, Y.C., Park, Y.B.: Size effect on the electromigration characteristics of flip chip Pb-free solder bumps. Electron. Mater. Lett 18, 431–439 (2022). https://doi.org/10.1007/s13391-022-00356-6
4. Kuan, W.C., Liang, S.W., Chen, C.: Effect of bump size on current density and temperature distributions in flip-chip solder joints. Microelectron. Reliab. 49, 544–550 (2009). https://doi.org/10.1016/j.microrel.2009.03.001
5. Jeong, H., Lee, C.J., Kim, J.H., Son, J.Y., Jung, S.B.: Electromigration behavior of Cu core solder joints under high current density. Electron. Mater. Lett. 16, 513–519 (2020). https://doi.org/10.1007/s13391-020-00239-8
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