Electromigration Behavior of Cu Core Solder Joints Under High Current Density
Author:
Funder
Ministry of Education
Ministry of Trade, Industry and Energy
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s13391-020-00239-8.pdf
Reference29 articles.
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