Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging-Reference-Cited by-同舟云学术

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

Published:2019-05-17 Issue:4 Volume:141 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Lau John H.¹

Affiliation:

1. ASM Pacific Technology, Hong Kong, China e-mail:

Abstract

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die face-down, and (c) chip last or redistribution layer (RDL)-first; (B) the RDL fabrications such as (a) organic RDLs, (b) inorganic RDLs, (c) hybrid RDLs, and (d) laser direct imaging (LDI)/printed circuit board (PCB) Cu platting and etching RDLs; (C) warpage; (D) thermal performance; (E) the temporary wafer versus panel carriers; and (F) the reliability of packages on PCBs subjected to thermal cycling condition. Some opportunities for FOW/PLP will be presented.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4043341/6049158/ep_141_04_040801.pdf

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