Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers-Reference-Cited by-同舟云学术

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Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers

Published:2024-05-28 Issue: Volume: Page:710-714
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Kim Nahyeon¹,Jung Haksoon²,Lee Yongwoo²,Eum Sungmin¹,Han Yechan²,Park Hyunjin³,Park Yunsik⁴,Kwon Jimin²

Affiliation:

1. Ulsan National Institute of Science and Technology (UNIST),School of Semiconductor Materials and Devices Engineering,Ulsan,Republic of Korea

2. Ulsan National Institute of Science and Technology (UNIST),Department of Electrical Engineering,Ulsan,Republic of Korea

3. Korea Research Institute of Chemical Technology (KRICT),Chemical Materials Solutions Center,Daejeon,Republic of Korea

4. Korea Electronics Technology Institute (KETI),ICT Device & Packaging Research Center,Seongnam,Republic of Korea

Funder

National Research Foundation

Korea Institute for Advancement of Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565076.pdf?arnumber=10565076

Reference21 articles.

1. Big Data, artificial intelligence and laboratory medicine: time for integration

2. Deep learning in big data Analytics: A comparative study

3. Efficient Automated Processing of the Unstructured Documents Using Artificial Intelligence: A Systematic Literature Review and Future Directions

4. Examining computational thinking processes in modeling unstructured data

5. Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

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