Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad-Reference-Cited by-同舟云学术

Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad

Published:2003-09-15 Issue:6 Volume:94 Page:4108-4115
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Alam M. O.,Chan Y. C.,Tu K. N.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1602563

Reference16 articles.

1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

2. Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

3. Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

4. Barrier Layers Against Diffusion

5. Correlation between Ni3Sn4 intermetallics and Ni3P due to solder reaction-assisted crystallization of electroless Ni–P metallization in advanced packages

Cited by 92 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders;Applied Surface Science;2023-07

2. Development of solderable layer on power MOSFET for double-side bonding;Microelectronics Reliability;2022-02

3. Effects of W contents on the solid-state interfacial reactions of Sn/Co-W;Journal of Materials Science;2022-01

4. Pd/Cu(220) interdiffusion under compressive stress;Materials Chemistry and Physics;2021-10

5. Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy;Materials;2021-05-14