Pd/Cu(220) interdiffusion under compressive stress-Reference-Cited by-同舟云学术

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Pd/Cu(220) interdiffusion under compressive stress

Published:2021-10 Issue: Volume:271 Page:124882
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Liu Cheng-Yi,Chiu Chung-Yu,Lin Erh-Ju,Chang Pai-Jung,Tang Yue-Kai,Yang Kun-Hui

Funder

Taiwan Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference35 articles.

1. Vacancy-formation energies for fcc and bcc transition metals;Korhonen;Phys. Rev. B,1995

2. Vacancy-formation energies at the (111) surface and in bulk Al, Cu, Ag, and Rh;Polatoglou;Phys. Rev. B,1993

3. Hydrogen-induced enhancement of interdiffusion in Cu-Ni diffusion couples;Hayashi;Phys. Rev. Lett.,1998

4. Analysis of Cu–Ni diffusion in a spherical geometry for excess vacancy production;Masumura;Acta Mater.,2002

5. Determination of intrinsic diffusion coefficients in a wide concentration range of a Cu–Ni couple by the multiple markers method;Iijima;Trans. Jpn. Inst. Metals,1982

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