Author:
Hung K. C.,Chan Y. C.,Tang C. W.,Ong H. C.
Abstract
Ni3Sn4 intermetallic was formed by the depletion of Ni from electroless Ni–P, and a Ni3P layer was formed simultaneously due to solder reaction-assisted crystallization during solder reflow. Both Ni3Sn4 and Ni3P grew rapidly due to the solder reaction-assisted crystallization and their growth was diffusion controlled during the first 15 min of annealing at 220 °C. After that, the growth rate of Ni3Sn4 was greatly reduced and the crystallization of electroless Ni–P to Ni3P was no longer induced. Based on kinetic data and scanning electron microscope morphology observations, underlying mechanisms causing this specific phenomenon are proposed. This finding is indeed very crucial since we may control the growth of Ni–Sn intermetallics by monitoring the solder reaction-assisted crystallization of electroless Ni–P.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
45 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献