Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere-Reference-Cited by-同舟云学术

Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

Published:2019-10-30 Issue:7 Volume:55 Page:3107-3117
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

He Siliang^ORCID,Gao Runhua,Shen Yu-An,Li Jiahui,Nishikawa Hiroshi

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-019-04153-9.pdf

Reference62 articles.

1. Kotadia HR, Howes PD, Mannan SH (2014) A review: on the development of low melting temperature Pb-free solders. Microelectron Reliab 54:1253–1273

2. Lee N-C (1999) Lead-free soldering-where the world is going. Adv Microelectron 26:29

3. Kang SK, Sarkhel AK (1994) Lead (Pb)-free solders for electronic packaging. J Electron Mater 23:701–707

4. Wood E, Nimmo K (1994) In search of new lead-free electronic solders. J Electron Mater 23:709–713

5. Suganuma K (2001) Advances in lead-free electronics soldering. Curr Opin Solid State Mater Sci 5:55–64

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