Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Author:

He SiliangORCID,Shen Yu-AnORCID,Xiong Bifu,Huo Fupeng,Li JiahuiORCID,Ge Jinguo,Pan Zhiliang,Li Wangyun,Hu Chuan,Nishikawa Hiroshi

Publisher

Elsevier BV

Subject

Environmental Engineering

Reference54 articles.

1. Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties;Zhong;Mater Des,2022

2. Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints;Chantaramanee;Microelectron Reliab,2021

3. Lead-free soldering, materials for advanced packaging;Lee,2016

4. A review: lead free solder and its wettability properties;Mhd Noor;Solder Surf Mt Technol,2016

5. Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0 Ag-0.5 Cu and interlayer formation of multi-element intermetallic compound;Shen;Appl Surf Sci,2021

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