Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere-Reference-Cited by-同舟云学术

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Published:2023-03-16 Issue:6 Volume:16 Page:2389
ISSN:1996-1944
Container-title:Materials
language:en
Short-container-title:Materials

Author:

He Siliang¹²,Xiong Bifu¹,Xu Fangyi¹,Chen Biyang¹^ORCID,Cui Yinhua²^ORCID,Hu Chuan²,Yue Gao¹³,Shen Yu-An⁴^ORCID

Affiliation:

1. Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

2. Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China

3. Guilin Fuda Co., Ltd., Guilin 541199, China

4. Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan

Abstract

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu6Sn5 forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu3Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.

Funder

Guangxi Natural Science Foundation

Science and Technology Planning Project of Guangxi

China Postdoctoral Science Foundation

GDAS’ Project of Science and Technology Development

Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology

Innovation Project of GUET Graduate Education

National Science and Technology Council of Taiwan

Publisher

MDPI AG

Subject

General Materials Science

Link

https://www.mdpi.com/1996-1944/16/6/2389/pdf

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