Wetting behavior between solder and electroless nickel deposits
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference24 articles.
1. The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys
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3. Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers;Metallurgical and Materials Transactions A;2016-06-08
4. History–From the Discovery of Electroless Plating to the Present;Amorphous and Nano Alloys Electroless Depositions;2016
5. Effect of structural transition in an amorphous Ni80P20 alloy on the wetting by a eutectic Sn–Bi solder;Journal of Materials Science;2014-01-14
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