Effect of structural transition in an amorphous Ni80P20 alloy on the wetting by a eutectic Sn

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Effect of structural transition in an amorphous Ni80P20 alloy on the wetting by a eutectic Sn–Bi solder

Published:2014-01-14 Issue:7 Volume:49 Page:2932-2942
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Shen Ping,Yang Jun,Wang Yi,Guo Ruifen,Jiang Qichuan

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-013-8004-3.pdf

Reference24 articles.

1. Tu KN, Zeng K (2001) Tin–lead (Sn–37Pb) solder reaction in flip chip technology. Mater Sci Eng 34:1–58

2. He M, Chen Z, Qi GJ (2004) Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Mater 52:2047–2056

3. Liu PL, Shang JK (2000) Thermal stability of electroless–nickel/solder interface: part A. Interfacial chemistry and microstructure, Metall Mater Trans A 31:2857–2866

4. Allen RM, VanderSande JB (1982) The structure of electroless Ni–P films as a function of composition. Scripta Metall 16:1161–1164

5. Dietz G, Schneider HD (1990) Decomposition of crystalline ferromagnetic particles precipitated in amorphous paramagnetic Ni–P. J Phys 2:2169

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The wettability of metallic glasses: a review;Surface Science and Technology;2024-02-01

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