Author:
Liu Pi Lin,Xu Zhengkui,Shang Jian Ku
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanics of Materials,Condensed Matter Physics
Reference37 articles.
1. John H. Lau and Yi-Hsin Pao: Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, McGraw-Hill Book Co., New York, NY, 1997.
2. L. Quan, D. Frear, D. Grivas, and J.W. Morris Jr.: J. Electronic Mater., 1987, vol. 16, pp. 203–08.
3. H.N. Keller: IEEE Trans. Comp. Hybrids, Manuf. Technol., 1986, vol. CHMT-9, pp. 433–39.
4. D.R. Frear and P.T. Vianco: Metall. Mater. Trans. A, 1994, vol. 25A, pp. 1509–23.
5. D. Gravas, D. Frear, L. Quan, and J.W. Morris Jr.: J. Electronic Mater., 1986, vol. 15, pp. 355–59.
Cited by
58 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献