1. Ivan Szendiuch, Development in electronic packaging—moving to 3D system configuration. Radio Eng. 20(1), 214–220 (2011)
2. Y. Nakamura, S. Katogi, Technology Trends and Future History of Semiconductor Packaging Substrate Material. Hitachi Chemical Technical Report No. 55, Published by Hitachi Chemical (2013)
3. C.F. Coombs, Jr., Printed Circuits Handbook, 6th Edition. McGraw-Hill (2008)
4. M. Jassal, S. Ghosh, Aramid fibres—an overview. Indian J. Fibre Text. Res. 27, 290–306 (2002)
5. S. Bagen, D. Alcoe, F.D. Egitto, R.N. Das, G. Thomas, Advanced organic to enable extreme electronics miniaturization, in Presented on IEEE Components, Packaging and Manufacturing Technology Chapter. Endicott Interconnect Technologies, Inc., Santa Clara Valley (February 13, 2013)