Wettability and interfacial reactions of Sn-based Pb-free solders with Cu–xZn alloy under bump metallurgies
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint
2. Studies of the mechanical and electrical properties of lead-free solder joints
3. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies;Puttlitz,2004
4. Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
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2. Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system;Vacuum;2019-09
3. Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys;Journal of Electronic Materials;2018-08-13
4. Interfacial reaction and microstructure between the Sn3Ag0.5Cu solder and Cu–Co dual-phase substrate;Applied Physics A;2018-06-11
5. Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging;Journal of Alloys and Compounds;2016-12
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