Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications-Reference-Cited by-同舟云学术

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Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

Published:2005-07 Issue:4.5 Volume:49 Page:607-620
ISSN:0018-8646
Container-title:IBM Journal of Research and Development
language:
Short-container-title:IBM J. Res. & Dev.

Author:

Kang S. K.,Lauro P.,Shih D.-Y.,Henderson D. W.,Puttlitz K. J.

Publisher

IBM

Subject

General Computer Science

Link

http://xplorestaging.ieee.org/ielx5/5288520/5388808/05388818.pdf?arnumber=5388818

Cited by 103 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The impact of paste alloy, paste volume, and surface finish on solder joint;Microelectronics Reliability;2024-09

2. Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application;Materials Science in Semiconductor Processing;2024-08

3. Finite element method and experimental study on life prediction of lead-free BGA solder joints using an energy-based approach;Journal of Materials Science: Materials in Electronics;2024-07

4. Fabrication of smooth SAC305 thin film via magnetron sputtering;Journal of Materials Science: Materials in Electronics;2024-06

5. Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review;Materials;2024-05-15

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