Reliability of laser soldering using low melting temperature eutectic Sn Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference33 articles.
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Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructure evolution and deformation behaviour of Sn-xBi-1Ag Solder alloys: Influences of Bi content;Materials Science and Engineering: A;2024-09
2. Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances;Materials Today Communications;2024-06
3. Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing;Journal of Materials Research and Technology;2024-03
4. Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding;Materials Today Communications;2024-03
5. Intermetallic compound evolution and mechanical properties of Cu/Sn58Bi/Cu 3D structures blended with B4C nanoparticles during isothermal aging;Journal of Materials Research and Technology;2023-05
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