Author:
Zhang Shuai,Qiu Qingyang,Ding Tianran,Long Weimin,Zhong Sujuan,Paik Kyung-Wook,He Peng,Zhang Shuye
Reference32 articles.
1. Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: a recent review;Wang;J. Adv. Join. Process.,2022
2. Effect of electric current stressing on mechanical performance of solders and solder joints: a review;Wang;J. Mater. Sci.,2022
3. Challenges and recent prospectives of 3D heterogeneous integration;Zhang;E-Prime - Adv. Electr. Eng., Electron. Energy,2022
4. Recent advances in nano-materials for packaging of electronic devices;Zhang;J. Mater. Sci.: Mater. Electron.,2019
5. The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface;Wang;J. Mater. Res. Technol.,2023
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献