The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface
Author:
Funder
Natural Science Foundation Project of Chongqing
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference29 articles.
1. Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology;Shen;Mater Design,2019
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3. Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging;Zhou;J Alloys Compd,2018
4. Improved reliability and mechanical performance of Ag microalloyed Sn58Bi solder alloys;Ren;Metals,2019
5. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections;Ren;J Alloys Compd,2016
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