Author:
Kim Seahwan,Min Kyung Deuk,Yoon Jeong-Won,Jung Seung-Boo
Funder
Ministry of Science, ICT and Future Planning
National Research Foundation of Korea
Korea Ministry of Science and ICT
Reference39 articles.
1. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011
2. Low melting point solders based on Sn, Bi, and In elements;Liu;Mater. Today Adv.,2020
3. Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing;Cheng;Microelectron. Reliab.,2016
4. The application of bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems;Mokler,2016
5. Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology;Shen;Mater. Des.,2019