Funder
Ministry of Education, Culture, Sports, Science and Technology
Ministry of Science and Technology of Taiwan
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference42 articles.
1. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011
2. A. Yoshida, Jun Taniguchi, K. Murata, M. Kada, Y. Yamamoto, Y. Takagi, T. Notomi, A. Fujita, A study on package stacking process for package-on-package (PoP), in: 56th Electron. Components Technol. Conf. 2006, IEEE, n.d.: pp. 825–830. doi:https://doi.org/10.1109/ECTC.2006.1645753.
3. Advanced 3D eWLB-PoP (embedded wafer level ball grid array-package on package) technology;Lin,2016
4. FOWLP: PoP, in: Fan-out Wafer-Level Packag;Lau,2018
5. Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages;Yang;Microelectron. Reliab.,2006
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