Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections
Author:
Funder
Irish Research Council
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference86 articles.
1. Recent advances of nanolead-free solder material for low processing temperature interconnect applications;Jiang;Microelectron. Reliab.,2013
2. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014
3. Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO(2) solder joints in reflow process;Tang;J. Alloys Compd.,2013
4. Lead-free reflow soldering for electronics assembly;Harrison;Solder. Surf. Mt. Technol.,2001
5. SnZn solder alternative for low-cost Pb-free surface mount assemblies;Jackson,2012
Cited by 99 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology;Materials Characterization;2024-02
2. Role of solute clustering and grain orientation on electrochemical degradation of Sn-Bi coatings electrodeposited at different current densities;Electrochimica Acta;2024-02
3. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review;Materials;2023-12-14
4. Experimental determination and high-throughput calculation of the interdiffusion coefficient matrix and atomic mobility in Ag-rich fcc Ag–Sn–Zn alloys;Calphad;2023-12
5. Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles;Journal of Materials Science: Materials in Electronics;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3