Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

Author:

Ren Guang,Wilding Ian J.,Collins Maurice N.ORCID

Funder

Irish Research Council

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference86 articles.

1. Recent advances of nanolead-free solder material for low processing temperature interconnect applications;Jiang;Microelectron. Reliab.,2013

2. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014

3. Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO(2) solder joints in reflow process;Tang;J. Alloys Compd.,2013

4. Lead-free reflow soldering for electronics assembly;Harrison;Solder. Surf. Mt. Technol.,2001

5. SnZn solder alternative for low-cost Pb-free surface mount assemblies;Jackson,2012

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