Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints
2. Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
3. An investigation of effects of Sb on the intermetallic formation in Sn-3.5Ag-0.7Cu solder joints
4. A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
5. Effects of Sb addition on tensile strength of Sn–3.5Ag–0.7Cu solder alloy and joint
Cited by 87 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy;Journal of Materials Science: Materials in Electronics;2024-07
2. Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles;Journal of Materials Research and Technology;2024-03
3. Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO2 and Al2O3 Nanoparticles at Different Reflow Times;Nanomaterials;2023-10-23
4. Effect of the addition of CeO2 nanoparticles on the microstructure and shear properties of Sn–57Bi–1Ag solder alloy;Journal of Materials Research and Technology;2023-09
5. Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology;Journal of Materials Research and Technology;2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3