Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints
Author:
Funder
National Science Council of R.O.C.
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference13 articles.
1. Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
2. Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
3. Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
4. Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads
5. Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
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