Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2198809
Reference9 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
3. Thermal gradient in solder joints under electrical-current stressing
4. Electrochromic semiconductor nanocrystal films
5. Electromigration—A brief survey and some recent results
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