Thermal gradient in solder joints under electrical-current stressing-Reference-Cited by-同舟云学术

Thermal gradient in solder joints under electrical-current stressing

Published:2004-11 Issue:11 Volume:33 Page:1350-1354
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Shao T. L.,Chiu S. H.,Chen Chih,Yao D. J.,Hsu C. Y.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0164-0.pdf

Reference7 articles.

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4. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu, Appl. Phys. Lett. 75, 58 (1999).

5. T.Y.T. Lee, T.Y. Lee, and K.N. Tu, Proc. 51st Electronic Components Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 558–563.

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