Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2226989
Reference16 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
3. Current-crowding-induced electromigration failure in flip chip solder joints
4. Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints
5. Systematic design of antireflection coating for semi-infinite one-dimensional photonic crystals using Bloch wave expansion
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