Abstract
Due to the miniaturization of electronic devices, electromigration became one of the serious reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an important role in electromigration failures. Several studies have been carried out to investigate the effect of Sn grain orientation on electromigration. The efforts involve the influence of β-Sn grain orientation on the migration of Cu, Sn, and Ni atoms, on the morphology of the solder joint, and on the formation of Cu6Sn5 and (Cu, Ni)6Sn6 in the lead-free solder joint during electromigration. The current review provides a detailed review of past studies which were conducted to investigate the influence of β-Sn grain orientation on electromigration failures in lead-free solder joints.
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces
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