Defect inspection of flip chip solder joints based on non-destructive methods: A review-Reference-Cited by-同舟云学术

Defect inspection of flip chip solder joints based on non-destructive methods: A review

Published:2020-07 Issue: Volume:110 Page:113657
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Su Lei,Yu Xiaonan,Li Ke,Pecht Michael

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Open Foundation of State Key Lab of Digital Manufacturing Equipment Technology

111 project

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference89 articles.

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3. Pb-free solders for flip-chip interconnects;Frear;JOM,2001

4. Materials Characterization: Introduction to Microscopic and Spectroscopic Methods;Leng,2010

5. Automatic solder joint inspection;Bartlett;IEEE Transactions on Pattern Analysis & Machine Intelligence,1988

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