In situ monitoring of flip chip package process using thermal resistance network method and active thermography-Reference-Cited by-同舟云学术

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In situ monitoring of flip chip package process using thermal resistance network method and active thermography

Published:2024-06 Issue: Volume:225 Page:125402
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Zhou Bin,Qiao Jianxin,Su Yunkang,Huang Wentao,Li Longqiu

Funder

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference32 articles.

1. Thermomechanical studies of surface mounted microelectronics by finite element analysis;Tan;Composites Part B: Eng.,2019

2. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology;Tu;Mater. Sci. Eng.: R: Reports,2019

3. A multiparameter numerical modeling and simulation of the dipping process in microelectronics packaging;Li;IEEE T. Ind. Inform.,2019

4. Study on Dipping mathematical models for the solder flip-chip bonding in microelectronics packaging;Li;IEEE T. Ind. Inform.,2018

5. Solid-state qubits integrated with superconducting through-silicon vias;Yost;NPJ Quantum. Inform.,2020

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array;Microelectronics Journal;2024-09

2. Integration and evaluation of the high-precision MotionCam-3D into a 3D thermography system;Journal of Sensors and Sensor Systems;2024-06-04

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