Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging-Reference-Cited by-同舟云学术

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Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging

Published:2018-11 Issue:11 Volume:14 Page:4746-4754
ISSN:1551-3203
Container-title:IEEE Transactions on Industrial Informatics
language:
Short-container-title:IEEE Trans. Ind. Inf.

Author:

Li Junhui^ORCID,Tian Qing^ORCID,Zhang Haoliang,Chen Xinxin,Liu Xiaohe,Zhu Wenhui^ORCID

Funder

China High Technology R&D Program 973

Discovery Project of State Key Laboratory of High Performance Complex Manufacturing

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications,Information Systems,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/9424/8523838/08290714.pdf?arnumber=8290714

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In situ monitoring of flip chip package process using thermal resistance network method and active thermography;International Journal of Heat and Mass Transfer;2024-06

2. FCPBGA C4 Abnormal Leadfree Solder Bump Prevention;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding;IEEE Transactions on Industrial Electronics;2023-09

4. Intelligent diagnosis of flip chip solder joints with resolution enhanced SAM image;ISA Transactions;2023-07

5. Intelligent defect inspection of flip chip based on vibration signals and improved gcForest;Measurement;2023-06

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